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HMC5983
Characteristics
Conditions*
Min
Typ
Max
Units
General
ESD Voltage
Human Body Model (all pins)
Charged Device Model (all pins)
2000
750
Volts
Operating Temperature
Storage Temperature
Ambient
Ambient, unbiased
-30
-40
85
125
°C
°C
Reflow Classification
MSL 3, 260 C Peak Temperature
Package Size
Package Height
Length and Width
2.85
0.8
3.00
0.9
3.15
1.0
mm
mm
Package Weight
Absolute Maximum Ratings (* Tested at 25°C except stated otherwise.)
18
mg
Characteristics
Supply Voltage VDD
Supply Voltage VDDIO
Min
-0.3
-0.3
Max
4.8
4.8
Units
Volts
Volts
Reflow Classification
PIN CONFIGURATIONS
Table 1: Pin Configurations
MSL 3, 260 C Peak Temperature
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Name
SCL/SPI_SCK
VDD
NC
SPI_CS
SPI_SDO
I2C /~SPI
NC
SETP
SoC
C1
GND
SETC
VDDIO
NC
DRDY
SDA/SPI_SDI
Description
Serial Clock – I2C Master/Slave Clock or SPI Serial Clock
Power Supply (2.16V to 3.6V)
Not to be Connected
Chip Select line for SPI (active low). Tie to VDDIO for I2C Interface
SPI Serial Data Out
I2C / SPI selection pin. Connect to VDD for I2C (Also connect SPI_CS to VDDIO).
Connect to GND for SPI.
Not to be Connected
Set/Reset Strap Positive – S/R Capacitor (C2) Connection
Start of Conversion (leading edge active) Connect to Ground when this
function/pad is not used in application.
Reservoir Capacitor (C1) Connection
Supply Ground
S/R Capacitor (C2) Connection – Driver Side
IO Power Supply (1.71V to VDD)
Not to be Connected. No internal connection.
Data Ready, Interrupt Pin. Internally pulled high. Optional connection. Low for
>200 μsec when data are placed in the data output registers.
Serial Data – I2C Master/Slave Data or SPI Serial Data In or SPI Serial Data I/O
(SDI/O) for 3-wire interface
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